IPP Microelectronics Inspection & Test Event

As device complexity increases and power electronics continue to evolve, inspection and test at the back end of the process have never been more critical.

That is why IPP Group is hosting a dedicated Microelectronics Inspection and Test Event, bringing together leading technologies and experts focused on real-world quality assurance, not just theory.

This event is designed for engineers and manufacturers working with power devices, wire bonding and advanced packaging, who want to see equipment inaction and understand how inspection and test can be applied directly to their processes.

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A strong focus on inspection and test

The emphasis of the day will be firmly on back-end inspection and test, with live demonstrations and practical discussion around:

• X-ray and acoustic inspection
• Die and bond wire inspection
• Power device testing
• Bond pull and shear testing
• Plasma cleaning for improved reliability
• Wire bonding systems

Rather than high-volume production equipment, this event is aimed at hands-on evaluation, helping attendees understand how these technologies perform in realistic production and development environments.

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Technologies on show

Attendees will be able to see and discuss solutions from leading suppliers, including:

• Cupio Services – X-ray and SAM inspection
• CyberOptics – SQM2 die and bond wire inspection
• Seica – Power device testing solutions
• TRY – Bond pull and shear testing for power devices
• PVA TePla – Plasma cleaning systems
• Nordson – XS inline X-ray for bond wire inspection
• F&S Bondtec – Wire bonding systems

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Meet the experts

The event will also give attendees the opportunity to speak directly with industry specialists, including:

• Jochen from PVA TePla
• Richard from Nordson
• Bernd from Nordson
• Representatives from Seica and F&S

This is a chance to have open technical conversations, ask detailed questions and explore how each solution could fit your application.

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A hands-on event

Unlike traditional seminars, this will be a practical, interactive event. Wherever possible, attendees will be able to:

• See live demonstrations
• Discuss trial opportunities
• Explore specific use cases with equipment specialists

In addition, short presentations may be included on technologies thatare not physically present, such as SpinSAM and XM8000, which are typically aimed at high-volume production environments with more limited application in the UK.

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