PLACE-N-BOND Underfilms

This Patented Underfilm Technology of pre-formed thermoplastic corner/edge bonds BGA/LGA/CSP packages to the PCB to improve solder ball/joint and shock-drop reliability. If needing an underfill alternative for an application, PLACE-N-BONDTM Underfilm is the perfect solution.

PLACE-N-BONDTM is supplied in EIA-481 Standard carrier tape and can be picked and placed using a custom nozzle with existing SMT feeders on existing SMT assembly lines. Underfilm gets placed during component placement. The films are geometrically precise for each application and give better volume and placement control over dispensed type systems such as Underfill.

Unlike the alternative underfill, PLACE-N-BONDTM Underfilm bonding and gap fill happens during the reflow process, no secondary cure is required. The corner/edge bond doesn't encapsulate all of the balls under the BGA/LGA device making it 100% re-workable. It can be stored in standard warehouse temperatures and has a 10+ year shelf-life.

This product has been fully tested. Drop test results show a significant improvement in solder joint/ball and shock-drop reliability. PLACE-N-BONDTM is RoHS certified and can be applied in assemblies using standard Lead-Free reflow profiles.

Pouch Sealers 12 & 24 inch models as standard

  • PLC based control system
  • Touch Screen HMI - with key switch access control
  • Output ports for Calibration and data logging
  • Gas Flush option
  • All settings have Independent Process Alarms

AS/2 Pouch Sealers

  • Digital Temperature Controller
  • Digital timer
  • Digital Pressure Gauge
  • Process Alarms and outputs for control verification
  • Full process Alarm Package
  • Hinged, Lockable Lexan door over instrument panel
  • Output ports for calibration instruments

MD 1612, MD 2420 Tray Sealers

  • PLC controlled System with Touch Screen HMI
  • Short Cycle Indicator
  • High / Low – temperature alarm
  • High / Low – Pressure alarm
  • Seal Area 16 x 12 inches / 24 x 20 inches
  • Tray depth up to 3 inches /6 inches

MPK Series Pouch Sealers/Cutters

The CeraTek 12-MPK/2 and 24-MPK/2 are the first constant heat sealer/cutter systems for medical pouches, allowing medical device manufacturers to combine medical pouch sealing and cutting processes into one step following sterilization. The systems are CE and ISO 11607 compliant.

DDS2 Vacuum Chamber Hot Bar Pouch Sealer

The DDS/2 Vacuum Chamber Hot Bar Pouch Sealer was specifically engineered by SencorpWhite to answer the demand for a machine with the industry’s most advanced vacuum capabilities, the repeatability of a hot bar sealer, and the reliability of the SencorpWhite brand name.

Automated Pouch Sealer

SencorpWhite is the industry leader in the design and manufacture of thermoforming and sealing machinery.

The APM is Engineered to be the most reliable and repeatable pouch sealing system on the market for producing verified sealed pouches. Independent asynchronous carriages allow for the addition of multiple optional functionality such as seal Inspection, Print and Apply, RFID readers, Label Inspection etc.

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